UL ENIG Heavy copper pcb Hard Drive PCB Boards turnkey service
Surface. Immersion Gold, Au thickness: min.2u"
Layer. 14Layer
Material. FR4, RoHS compliance
PCB Thickness. 1.6mm+/-10%
E-Test. 100%
Outgoing Reports:Final Inspection Report, E-Test Report, Solderability Test Report, Microsection Report and so on.
Inspection Standard:IPC-A-600H/IPC-6012B Class2 and IPC-A-600H/IPC-6012B class3
Certificates:UL, RoHS, ISO
Quick Leadtime
Lead time for sample
2-3 days for single-sided board
4-5 days for double-sided board
6-7 days for multilayer board
24-48 hours for urgent
Lead time or opening Mould:
3-5 days for normal mould
5-7 days for hard mould
Lead time for mass production
5-7 days for single/double sided board
7-10 days for multilayer board
What we need
1. Gerber files of the bare PCB
2. Bill of materials to include: Manufacturer's part number, type of part, type of packaging, component locations listed by reference designators and quantity
3. Dimensional specifications for non-standard components
4. Assembly drawing, including any change notices
5. Final test procedures (if available)
PCB Feature
| Number of Layer |
1 - 20 Layer |
| Maximum Processing Area |
680 × 1000MM |
| Min Board Thickness |
2 Layer - 0.3MM ( 12 mil ) |
| 4 Layer - 0.4MM ( 16 mil ) |
| 6 Layer - 0.8MM ( 32 mil ) |
| 8 Layer - 1.0MM ( 40 mil) |
| 10 Layer - 1.1MM ( 44 mil ) |
| 12 Layer - 1.3MM ( 52 mil ) |
| 14 Layer - 1.5MM ( 59 mil ) |
| 16 Layer - 1.6MM ( 63 mil ) |
| 18 Layer - 1.8MM ( 71 mil ) |
| Finished Board Thickness Tolerance |
Thickness ≤ 1.0MM, Tolerance: ± 0.1MM |
| 1.0MM ≤ Thickness ≤ 6.5MM, Tolerance ± 10% |
| Twisting and Bending |
≤ 0.75%, Min: 0.5% |
| Range of TG |
130 - 215 ℃ |
| Impedance Tolerance |
± 10%, Min: ± 5% |
| Hi-Pot Test |
Max: 4000V/10MA/60S |
| Surface Treatment |
HASL, With Lead, HASL Free Lead |
| Flash Gold, Immersion Gold |
| Immersion Silver, Immersion Tin |
| Gold Finger, OSP |
PCBA capability and services SMT (Surface mounting technology), COB, DIP.
1. Material Sourcing Service
2. SMT assembly and Through hole components insertion
3. IC pre-programming / Burning on-line
4. Function testing as requested
5. Complete Unit assembly (which including plastics, metal box, Coil, cable inside etc)
6. OEM/ODM also welcomed
Packing Terms
1. Inner packing. All the goods will be packed by vacuum
2. Outer packing. Standard carton
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