Home > SMT PCB Assembly >

Access Control Electronic Prototype SMT Assembly 4 Layers 1.6mm Board Thickness

Product Categories

Shenzhen Shinelink Technology Ltd

Contact Now

Name: Access Control Electronic Prototype SMT Assembly 4 Layers 16mm Board Thickness
Brand: OEM and ODM
Price: 1 USD

Brand Name : OEM and ODM

Model Number : SL81023S004

Certification : UL,RoHS, CE

Place of Origin : China

MOQ : 1pc

Price : Negotiable

Payment Terms : T/T, Western Union, MoneyGram,Paypal

Supply Ability : 100000pcs per day

Delivery Time : 5-7 days

Packaging Details : Bubble Wrap

Layer : 4 layer

Board thickness : 1.6mm

Features 1 : Gerber/PCB file needed

Features 2 : 100% E-test

Features 3 : Quality 2 years guarantee

Contact Now

Access Control Electronic SMT PCB Assembly 4 Layers Fast Delivery

Our production capacity

PCB Item	Manufacture Capacity
Layer Counts	1--20L
Base Material	FR4,High-TG FR4,CEM3,aluminum,High Frequency(Rogers,Taconic,Aron,PTFE,F4B)
Material Thickness(mm)	0.40, 0.60, 0.80, 1.00, 1.20, 1.50, 1.60, 2.0, 2.4, 3.2
Max board size(mm)	1200x400mm
Board Outline Tolerance	±0.15mm
Board Thickness	0.4mm--3.2mm
Thickness Tolerance	±8%
Minimum line/space	0.1mm
Min Annular Ring	0.1mm
SMD Pitch	0.3mm
Holes
Min Hole Size(mechanical)	0.2mm
Min Hole Size(laser hole)	0.1mm
Hole Size Tol (+/-)	PTH:±0.075mm;NPTH: ±0.05mm
Hole Position Tol	±0.075mm
Plating
HASL/LF HAL	2.5um
Immersion Gold	Nickel 3-7um Au:1-5u''
Surface Finish	HAL,ENIG,Plated Gold,Immersion Gold,OSP
Copper
Copper Weight	0.5--6oz
Color
Solder mask	Green, Blue, Black, White, Yellow, Red, Matt Green, Matt Black, Matt Blue
Silk screen	White, Black, Blue,Yellow
Acceptable File Format	Gerber file,Powerpcb,CAD,AUTOCAD,ORCAD,P-CAD,CAM-350,CAM2000
Certificate	ROSH,ISO9001,UL

PCB Assembly Capability

Stencil Size	736x736mm
Minimum IC Pitch	0.2mm
Maximum PCB size	1200x 500mm
Minimum PCB thickness	0.25mm
Minimum chip size:	0201 (0.2x0.1)/0603 (0.6 x 0.3mm)
Maximum BGA size:	74x74mm
BGA ball pitch:	1.00mm (minimum), 3.00mm (maximum)
BGA ball diameter:	0.40mm (minimum), 1.00mm (maximum)
QFP lead pitch:	0.38mm (minimum), 2.54mm (maximum)
Volume:	One piece to low volume production quantities Low cost first article builds Schedule deliveries
Assembly type:	Surface mount(SMT) assembly DIP assembly Mixed(surface mount and through hole) technology Single or double sided placement Cable assembly
Components type:	Passive components: As small as 0402 package As small as 0201 with design review Ball Grid Arrays(BGA): As small as .5mm pitch
Parts procurements:	Turnkey(we supply the parts) Consigned(you supply the parts) You supply some parts, we do the rest
Solder type:	Leaded Lead-free/ROHS compliant
Other capabilities:	Repair/rework services Mechanical assembly Box build Mold and plastic injection.

PCBA Picture

Product Tags:

smt electronic assembly

Inquiry Cart 0

Send your message to this supplier


*From:	Your email address is incorrect!
*To:	Shenzhen Shinelink Technology Ltd
*Subject:	Subject is empty!
*Message:	For the best results, we recommend including the following details: -Self introduction -Required specifications -Inquire about price/MOQ Characters Remaining: (0/3000) Please enter 20 to 3000 characters to contact this supplier!